Three-dimensional deep sub-diffraction optical beam lithography with 9 nm feature size

Zongsong Gan, Yaoyu Cao, Richard A. Evans and Min Gu ()
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Zongsong Gan: Centre for Micro-Photonics and CUDOS, Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, P. O. Box 218
Yaoyu Cao: Centre for Micro-Photonics and CUDOS, Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, P. O. Box 218
Richard A. Evans: CSIRO Materials Science and Engineering, Bag 10
Min Gu: Centre for Micro-Photonics and CUDOS, Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, P. O. Box 218

Nature Communications, 2013, vol. 4, issue 1, 1-7

Abstract: Abstract The current nanofabrication techniques including electron beam lithography provide fabrication resolution in the nanometre range. The major limitation of these techniques is their incapability of arbitrary three-dimensional nanofabrication. This has stimulated the rapid development of far-field three-dimensional optical beam lithography where a laser beam is focused for maskless direct writing. However, the diffraction nature of light is a barrier for achieving nanometre feature and resolution in optical beam lithography. Here we report on three-dimensional optical beam lithography with 9 nm feature size and 52 nm two-line resolution in a newly developed two-photon absorption resin with high mechanical strength. The revealed dependence of the feature size and the two-line resolution confirms that they can reach deep sub-diffraction scale but are limited by the mechanical strength of the new resin. Our result has paved the way towards portable three-dimensional maskless laser direct writing with resolution fully comparable to electron beam lithography.

Date: 2013
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DOI: 10.1038/ncomms3061

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