Mouldable all-carbon integrated circuits

Dong-Ming Sun, Marina Y. Timmermans, Antti Kaskela, Albert G. Nasibulin, Shigeru Kishimoto, Takashi Mizutani, Esko I. Kauppinen and Yutaka Ohno ()
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Dong-Ming Sun: Nagoya University
Marina Y. Timmermans: NanoMaterials Group, Aalto University
Antti Kaskela: NanoMaterials Group, Aalto University
Albert G. Nasibulin: NanoMaterials Group, Aalto University
Shigeru Kishimoto: Nagoya University
Takashi Mizutani: Nagoya University
Esko I. Kauppinen: NanoMaterials Group, Aalto University
Yutaka Ohno: Nagoya University

Nature Communications, 2013, vol. 4, issue 1, 1-8

Abstract: Abstract A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm2 V−1 s−1 and an ON/OFF ratio of 105. The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.

Date: 2013
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DOI: 10.1038/ncomms3302

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