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Nanoscale determination of the mass enhancement factor in the lightly doped bulk insulator lead selenide

Ilija Zeljkovic, Kane L. Scipioni, Daniel Walkup, Yoshinori Okada, Wenwen Zhou, R Sankar, Guoqing Chang, Yung Jui Wang, Hsin Lin, Arun Bansil, Fangcheng Chou, Ziqiang Wang and Vidya Madhavan ()
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Ilija Zeljkovic: Boston College
Kane L. Scipioni: Boston College
Daniel Walkup: Boston College
Yoshinori Okada: Boston College
Wenwen Zhou: Boston College
R Sankar: Center for Condensed Matter Sciences, National Taiwan University
Guoqing Chang: Centre for Advanced 2D Materials and Graphene Research Centre, National University of Singapore
Yung Jui Wang: Northeastern University
Hsin Lin: Centre for Advanced 2D Materials and Graphene Research Centre, National University of Singapore
Arun Bansil: Northeastern University
Fangcheng Chou: Center for Condensed Matter Sciences, National Taiwan University
Ziqiang Wang: Boston College
Vidya Madhavan: Boston College

Nature Communications, 2015, vol. 6, issue 1, 1-5

Abstract: Abstract Bismuth chalcogenides and lead telluride/selenide alloys exhibit exceptional thermoelectric properties that could be harnessed for power generation and device applications. Since phonons play a significant role in achieving these desired properties, quantifying the interaction between phonons and electrons, which is encoded in the Eliashberg function of a material, is of immense importance. However, its precise extraction has in part been limited due to the lack of local experimental probes. Here we construct a method to directly extract the Eliashberg function using Landau level spectroscopy, and demonstrate its applicability to lightly doped thermoelectric bulk insulator PbSe. In addition to its high energy resolution only limited by thermal broadening, this novel experimental method could be used to detect variations in mass enhancement factor at the nanoscale level. This opens up a new pathway for investigating the local effects of doping and strain on the mass enhancement factor.

Date: 2015
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DOI: 10.1038/ncomms7559

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