Thermal conductance of metal–diamond interfaces at high pressure

Gregory T. Hohensee (), R.B. Wilson and David G. Cahill
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Gregory T. Hohensee: Materials Research Laboratory, University of Illinois at Urbana-Champaign
R.B. Wilson: Materials Research Laboratory, University of Illinois at Urbana-Champaign
David G. Cahill: Materials Research Laboratory, University of Illinois at Urbana-Champaign

Nature Communications, 2015, vol. 6, issue 1, 1-9

Abstract: Abstract The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two-phonon processes. The high pressures achievable in a diamond anvil cell (DAC) can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. Here we report time-domain thermoreflectance measurements of metal–diamond interface thermal conductance up to 50 GPa in the DAC for Pb, Au0.95Pd0.05, Pt and Al films deposited on type 1A natural [100] and type 2A synthetic [110] diamond anvils. In all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. Our results suggest that anharmonic conductance at metal–diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon.

Date: 2015
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DOI: 10.1038/ncomms7578

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