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Realizing high figure of merit in heavy-band p-type half-Heusler thermoelectric materials

Chenguang Fu, Shengqiang Bai, Yintu Liu, Yunshan Tang, Lidong Chen (), Xinbing Zhao and Tiejun Zhu ()
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Chenguang Fu: State Key Laboratory of Silicon Materials and School of Materials Science and Engineering, Zhejiang University
Shengqiang Bai: State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Yintu Liu: State Key Laboratory of Silicon Materials and School of Materials Science and Engineering, Zhejiang University
Yunshan Tang: State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Lidong Chen: State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Xinbing Zhao: State Key Laboratory of Silicon Materials and School of Materials Science and Engineering, Zhejiang University
Tiejun Zhu: State Key Laboratory of Silicon Materials and School of Materials Science and Engineering, Zhejiang University

Nature Communications, 2015, vol. 6, issue 1, 1-7

Abstract: Abstract Solid-state thermoelectric technology offers a promising solution for converting waste heat to useful electrical power. Both high operating temperature and high figure of merit zT are desirable for high-efficiency thermoelectric power generation. Here we report a high zT of ∼1.5 at 1,200 K for the p-type FeNbSb heavy-band half-Heusler alloys. High content of heavier Hf dopant simultaneously optimizes the electrical power factor and suppresses thermal conductivity. Both the enhanced point-defect and electron–phonon scatterings contribute to a significant reduction in the lattice thermal conductivity. An eight couple prototype thermoelectric module exhibits a high conversion efficiency of 6.2% and a high power density of 2.2 W cm−2 at a temperature difference of 655 K. These findings highlight the optimization strategy for heavy-band thermoelectric materials and demonstrate a realistic prospect of high-temperature thermoelectric modules based on half-Heusler alloys with low cost, excellent mechanical robustness and stability.

Date: 2015
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DOI: 10.1038/ncomms9144

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