Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits

Cheng Yang (), Xiaoya Cui, Zhexu Zhang, Sum Wai Chiang, Wei Lin, Huan Duan, Jia Li, Feiyu Kang and Ching-Ping Wong
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Cheng Yang: Graduate School at Shenzhen, Tsinghua University
Xiaoya Cui: Graduate School at Shenzhen, Tsinghua University
Zhexu Zhang: Graduate School at Shenzhen, Tsinghua University
Sum Wai Chiang: Graduate School at Shenzhen, Tsinghua University
Wei Lin: School of Materials Science and Engineering, Georgia Institute of Technology
Huan Duan: Graduate School at Shenzhen, Tsinghua University
Jia Li: Graduate School at Shenzhen, Tsinghua University
Feiyu Kang: Graduate School at Shenzhen, Tsinghua University
Ching-Ping Wong: The Chinese University of Hong Kong

Nature Communications, 2015, vol. 6, issue 1, 1-10

Abstract: Abstract Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely been explored in electronic printing or packaging applications because of the great challenges in large-scale synthesis and limited understanding in such applications. Here we demonstrate a controllable synthesis of fractal Ag micro-dendrites at the hundred-gram scale. When used as the fillers for isotropically electrically conductive composites (ECCs), the unique three-dimensional fractal geometrical configuration and low-temperature sintering characteristic render the Ag micro dendrites with an ultra-low electrical percolation threshold of 0.97 vol% (8 wt%). The ultra-low percolation threshold and self-limited fusing ability may address some critical challenges in current interconnect technology for microelectronics. For example, only half of the laser-scribe energy is needed to pattern fine circuit lines printed using the present ECCs, showing great potential for wiring ultrathin circuits for high performance flexible electronics.

Date: 2015
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DOI: 10.1038/ncomms9150

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