Cavity-less on-chip optomechanics using excitonic transitions in semiconductor heterostructures

Hajime Okamoto (), Takayuki Watanabe, Ryuichi Ohta, Koji Onomitsu, Hideki Gotoh, Tetsuomi Sogawa and Hiroshi Yamaguchi
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Hajime Okamoto: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Takayuki Watanabe: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Ryuichi Ohta: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Koji Onomitsu: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Hideki Gotoh: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Tetsuomi Sogawa: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation
Hiroshi Yamaguchi: NTT Basic Research Laboratories, Nippon Telegraph and Telephone Corporation

Nature Communications, 2015, vol. 6, issue 1, 1-6

Abstract: Abstract The hybridization of semiconductor optoelectronic devices and nanomechanical resonators provides a new class of optomechanical systems in which mechanical motion can be coupled to light without any optical cavities. Such cavity-less optomechanical systems interconnect photons, phonons and electrons (holes) in a highly integrable platform, opening up the development of functional integrated nanomechanical devices. Here we report on a semiconductor modulation-doped heterostructure–cantilever hybrid system, which realizes efficient cavity-less optomechanical transduction through excitons. The opto-piezoelectric backaction from the bound electron–hole pairs enables us to probe excitonic transition simply with a sub-nanowatt power of light, realizing high-sensitivity optomechanical spectroscopy. Detuning the photon energy from the exciton resonance results in self-feedback cooling and amplification of the thermomechanical motion. This cavity-less on-chip coupling enables highly tunable and addressable control of nanomechanical resonators, allowing high-speed programmable manipulation of nanomechanical devices and sensor arrays.

Date: 2015
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DOI: 10.1038/ncomms9478

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