A series connection architecture for large-area organic photovoltaic modules with a 7.5% module efficiency

Soonil Hong, Hongkyu Kang (), Geunjin Kim, Seongyu Lee, Seok Kim, Jong-Hoon Lee, Jinho Lee, Minjin Yi, Junghwan Kim, Hyungcheol Back, Jae-Ryoung Kim and Kwanghee Lee ()
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Soonil Hong: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Hongkyu Kang: Heeger Center for Advanced Materials, Gwangju Institute of Science and Technology
Geunjin Kim: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Seongyu Lee: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Seok Kim: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Jong-Hoon Lee: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Jinho Lee: Heeger Center for Advanced Materials, Gwangju Institute of Science and Technology
Minjin Yi: Research Institute for Solar and Sustainable Energies, Gwangju Institute of Science and Technology
Junghwan Kim: Heeger Center for Advanced Materials, Gwangju Institute of Science and Technology
Hyungcheol Back: School of Materials Science and Engineering, Gwangju Institute of Science and Technology
Jae-Ryoung Kim: Research Institute for Solar and Sustainable Energies, Gwangju Institute of Science and Technology
Kwanghee Lee: School of Materials Science and Engineering, Gwangju Institute of Science and Technology

Nature Communications, 2016, vol. 7, issue 1, 1-6

Abstract: Abstract The fabrication of organic photovoltaic modules via printing techniques has been the greatest challenge for their commercial manufacture. Current module architecture, which is based on a monolithic geometry consisting of serially interconnecting stripe-patterned subcells with finite widths, requires highly sophisticated patterning processes that significantly increase the complexity of printing production lines and cause serious reductions in module efficiency due to so-called aperture loss in series connection regions. Herein we demonstrate an innovative module structure that can simultaneously reduce both patterning processes and aperture loss. By using a charge recombination feature that occurs at contacts between electron- and hole-transport layers, we devise a series connection method that facilitates module fabrication without patterning the charge transport layers. With the successive deposition of component layers using slot-die and doctor-blade printing techniques, we achieve a high module efficiency reaching 7.5% with area of 4.15 cm2.

Date: 2016
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DOI: 10.1038/ncomms10279

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