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Enhancing radiation tolerance by controlling defect mobility and migration pathways in multicomponent single-phase alloys

Chenyang Lu, Liangliang Niu, Nanjun Chen, Ke Jin, Taini Yang, Pengyuan Xiu, Yanwen Zhang, Fei Gao, Hongbin Bei, Shi Shi, Mo-Rigen He, Ian M. Robertson, William J. Weber and Lumin Wang ()
Additional contact information
Chenyang Lu: University of Michigan
Liangliang Niu: University of Michigan
Nanjun Chen: University of Michigan
Ke Jin: Oak Ridge National Laboratory
Taini Yang: University of Michigan
Pengyuan Xiu: University of Michigan
Yanwen Zhang: Oak Ridge National Laboratory
Fei Gao: University of Michigan
Hongbin Bei: Oak Ridge National Laboratory
Shi Shi: University of Wisconsin-Madison
Mo-Rigen He: University of Wisconsin-Madison
Ian M. Robertson: University of Wisconsin-Madison
William J. Weber: Oak Ridge National Laboratory
Lumin Wang: University of Michigan

Nature Communications, 2016, vol. 7, issue 1, 1-8

Abstract: Abstract A grand challenge in material science is to understand the correlation between intrinsic properties and defect dynamics. Radiation tolerant materials are in great demand for safe operation and advancement of nuclear and aerospace systems. Unlike traditional approaches that rely on microstructural and nanoscale features to mitigate radiation damage, this study demonstrates enhancement of radiation tolerance with the suppression of void formation by two orders magnitude at elevated temperatures in equiatomic single-phase concentrated solid solution alloys, and more importantly, reveals its controlling mechanism through a detailed analysis of the depth distribution of defect clusters and an atomistic computer simulation. The enhanced swelling resistance is attributed to the tailored interstitial defect cluster motion in the alloys from a long-range one-dimensional mode to a short-range three-dimensional mode, which leads to enhanced point defect recombination. The results suggest design criteria for next generation radiation tolerant structural alloys.

Date: 2016
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DOI: 10.1038/ncomms13564

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