Self-assembled three dimensional network designs for soft electronics

Kyung-In Jang, Kan Li, Ha Uk Chung, Sheng Xu, Han Na Jung, Yiyuan Yang, Jean Won Kwak, Han Hee Jung, Juwon Song, Ce Yang, Ao Wang, Zhuangjian Liu, Jong Yoon Lee, Bong Hoon Kim, Jae-Hwan Kim, Jungyup Lee, Yongjoon Yu, Bum Jun Kim, Hokyung Jang, Ki Jun Yu, Jeonghyun Kim, Jung Woo Lee, Jae-Woong Jeong, Young Min Song, Yonggang Huang (), Yihui Zhang () and John A. Rogers ()
Additional contact information
Kyung-In Jang: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Kan Li: Mechanical Engineering, and Materials Science and Engineering, Northwestern University
Ha Uk Chung: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Sheng Xu: University of California at San Diego
Han Na Jung: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Yiyuan Yang: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Jean Won Kwak: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Han Hee Jung: Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Juwon Song: Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Ce Yang: Center for Mechanics and Materials, AML, Tsinghua University
Ao Wang: Mechanical Engineering, and Materials Science and Engineering, Northwestern University
Zhuangjian Liu: Institute of High Performance Computing
Jong Yoon Lee: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Bong Hoon Kim: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Jae-Hwan Kim: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Jungyup Lee: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Yongjoon Yu: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Bum Jun Kim: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Hokyung Jang: Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign
Ki Jun Yu: School of Electrical and Electronic Engineering, Yonsei University
Jeonghyun Kim: Kwangwoon University
Jung Woo Lee: Pusan National University
Jae-Woong Jeong: Computer and Energy Engineering, University of Colorado
Young Min Song: School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology
Yonggang Huang: Mechanical Engineering, and Materials Science and Engineering, Northwestern University
Yihui Zhang: Center for Mechanics and Materials, AML, Tsinghua University
John A. Rogers: Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University

Nature Communications, 2017, vol. 8, issue 1, 1-10

Abstract: Abstract Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

Date: 2017
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DOI: 10.1038/ncomms15894

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