Transparent flexible thermoelectric material based on non-toxic earth-abundant p-type copper iodide thin film

C. Yang (), D. Souchay, M. Kneiß, M. Bogner, H. M. Wei, M. Lorenz, O. Oeckler, G. Benstetter, Y. Q. Fu and M. Grundmann
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C. Yang: Felix-Bloch-Institut für Festkörperphysik, Universität Leipzig
D. Souchay: Institut für Mineralogie, Kristallographie und Materialwissenschaft, Universität Leipzig
M. Kneiß: Felix-Bloch-Institut für Festkörperphysik, Universität Leipzig
M. Bogner: Deggendorf Institute of Technology
H. M. Wei: Felix-Bloch-Institut für Festkörperphysik, Universität Leipzig
M. Lorenz: Felix-Bloch-Institut für Festkörperphysik, Universität Leipzig
O. Oeckler: Institut für Mineralogie, Kristallographie und Materialwissenschaft, Universität Leipzig
G. Benstetter: Deggendorf Institute of Technology
Y. Q. Fu: Faculty of Engineering and Environment, Northumbria University
M. Grundmann: Felix-Bloch-Institut für Festkörperphysik, Universität Leipzig

Nature Communications, 2017, vol. 8, issue 1, 1-7

Abstract: Abstract Thermoelectric devices that are flexible and optically transparent hold unique promise for future electronics. However, development of invisible thermoelectric elements is hindered by the lack of p-type transparent thermoelectric materials. Here we present the superior room-temperature thermoelectric performance of p-type transparent copper iodide (CuI) thin films. Large Seebeck coefficients and power factors of the obtained CuI thin films are analysed based on a single-band model. The low-thermal conductivity of the CuI films is attributed to a combined effect of the heavy element iodine and strong phonon scattering. Accordingly, we achieve a large thermoelectric figure of merit of ZT=0.21 at 300 K for the CuI films, which is three orders of magnitude higher compared with state-of-the-art p-type transparent materials. A transparent and flexible CuI-based thermoelectric element is demonstrated. Our findings open a path for multifunctional technologies combing transparent electronics, flexible electronics and thermoelectricity.

Date: 2017
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DOI: 10.1038/ncomms16076

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