Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices

Amirkoushyar Ziabari, Pol Torres, Bjorn Vermeersch, Yi Xuan, Xavier Cartoixà, Alvar Torelló, Je-Hyeong Bahk, Yee Rui Koh, Maryam Parsa, Peide D. Ye, F. Xavier Alvarez and Ali Shakouri ()
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Amirkoushyar Ziabari: Purdue University
Pol Torres: Universitat Autònoma de Barcelona
Bjorn Vermeersch: Le Laboratoire d‘Innovation pour les Technologies des Energies Nouvelles et les nanomatériaux (LITEN)
Yi Xuan: Purdue University
Xavier Cartoixà: Universitat Autònoma de Barcelona
Alvar Torelló: Universitat Autònoma de Barcelona
Je-Hyeong Bahk: Purdue University
Yee Rui Koh: Purdue University
Maryam Parsa: Purdue University
Peide D. Ye: Purdue University
F. Xavier Alvarez: Universitat Autònoma de Barcelona
Ali Shakouri: Purdue University

Nature Communications, 2018, vol. 9, issue 1, 1-7

Abstract: Abstract Understanding nanoscale thermal transport is of substantial importance for designing contemporary semiconductor technologies. Heat removal from small sources is well established to be severely impeded compared to diffusive predictions due to the ballistic nature of the dominant heat carriers. Experimental observations are commonly interpreted through a reduction of effective thermal conductivity, even though most measurements only probe a single aggregate thermal metric. Here, we employ thermoreflectance thermal imaging to directly visualise the 2D temperature field produced by localised heat sources on InGaAs with characteristic widths down to 100 nm. Besides displaying effective thermal performance reductions up to 50% at the active junctions in agreement with prior studies, our steady-state thermal images reveal that, remarkably, 1–3 μm adjacent to submicron devices the crosstalk is actually reduced by up to fourfold. Submicrosecond transient imaging additionally shows responses to be faster than conventionally predicted. A possible explanation based on hydrodynamic heat transport, and some open questions, are discussed.

Date: 2018
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DOI: 10.1038/s41467-017-02652-4

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