Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

Saranshu Singla, Gaurav Amarpuri, Nishad Dhopatkar, Todd A. Blackledge and Ali Dhinojwala ()
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Saranshu Singla: The University of Akron
Gaurav Amarpuri: The University of Akron
Nishad Dhopatkar: The University of Akron
Todd A. Blackledge: The University of Akron
Ali Dhinojwala: The University of Akron

Nature Communications, 2018, vol. 9, issue 1, 1-8

Abstract: Abstract Adhesion in humid environments is fundamentally challenging because of the presence of interfacial bound water. Spiders often hunt in wet habitats and overcome this challenge using sticky aggregate glue droplets whose adhesion is resistant to interfacial failure under humid conditions. The mechanism by which spider aggregate glue avoids interfacial failure in humid environments is still unknown. Here, we investigate the mechanism of aggregate glue adhesion by using interface-sensitive spectroscopy in conjunction with infrared spectroscopy. We demonstrate that glycoproteins act as primary binding agents at the interface. As humidity increases, we observe reversible changes in the interfacial secondary structure of glycoproteins. Surprisingly, we do not observe liquid-like water at the interface, even though liquid-like water increases inside the bulk with increasing humidity. We hypothesize that the hygroscopic compounds in aggregate glue sequester interfacial water. Using hygroscopic compounds to sequester interfacial water provides a novel design principle for developing water-resistant synthetic adhesives.

Date: 2018
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DOI: 10.1038/s41467-018-04263-z

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