Performance investigation of a micro-channel flat separated loop heat pipe system for data centre cooling
Comparison of sustainable information technologies for companies
Menglong Hu,
Liang Luo,
Ali Badiei,
Fucheng Chen,
Siming Zheng,
Zhangyuan Wang and
Xudong Zhao
International Journal of Low-Carbon Technologies, 2021, vol. 16, issue 1, 98-113
Abstract:
This paper investigates a novel micro-channel flat separated loop heat pipe system for cooling the information technology equipment in the data centres through theoretical and experimental analysis and by assessing the impact of the inlet water temperature on system performance. A computer model is developed to simulate the steady-state performance of the micro-channel flat separated loop heat pipe system. After comparing the experimental and modelling results, the new and conventional system under the same working conditions, the model is validated yielding high accuracy in predicting the performance of the micro-channel flat separated loop heat pipe system with recorded error being limited to 2.16–8.97%. The new system has better performance than the conventional system. Under the operating conditions of heat load intensity of 1,000 W/m2, water flow rate of 0.28 m3/h, refrigerant filling rate of 30%, ambient air temperature of 26°C, and evaporator and condenser height difference of 0.8 m, the performance of the system has been explored at inlet temperature from 15 to 24°C with increments of 3°C. The system’s averaged heat transfer efficiency was found to decrease with the increase in inlet temperature. This research provides valuable insight into the data centre information technology equipment cooling, which is of great significance for energy saving and environmentally friendly operation of data centres.
Keywords: data centre; cooling; micro-channel; separated loop heat pipe; experiment (search for similar items in EconPapers)
Date: 2021
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Citations: View citations in EconPapers (2)
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Persistent link: https://EconPapers.repec.org/RePEc:oup:ijlctc:v:16:y:2021:i:1:p:98-113.
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