A New Model for Temperature Jump at a Fluid-Solid Interface

Jian-Jun Shu, Ji Bin Melvin Teo and Weng Kong Chan

PLOS ONE, 2016, vol. 11, issue 10, 1-12

Abstract: The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature.

Date: 2016
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Persistent link: https://EconPapers.repec.org/RePEc:plo:pone00:0165175

DOI: 10.1371/journal.pone.0165175

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