A monitoring method of semiconductor manufacturing processes using Internet of Things–based big data analysis

Seok-Woo Jang and Gye-Young Kim

International Journal of Distributed Sensor Networks, 2017, vol. 13, issue 7, 1550147717721810

Abstract: This article proposes an intelligent monitoring system for semiconductor manufacturing equipment, which determines spec-in or spec-out for a wafer in process, using Internet of Things–based big data analysis. The proposed system consists of three phases: initialization, learning, and prediction in real time. The initialization sets the weights and the effective steps for all parameters of equipment to be monitored. The learning performs a clustering to assign similar patterns to the same class. The patterns consist of a multiple time-series produced by semiconductor manufacturing equipment and an after clean inspection measured by the corresponding tester. We modify the Line, Buzo, and Gray algorithm for classifying the time-series patterns. The modified Line, Buzo, and Gray algorithm outputs a reference model for every cluster. The prediction compares a time-series entered in real time with the reference model using statistical dynamic time warping to find the best matched pattern and then calculates a predicted after clean inspection by combining the measured after clean inspection, the dissimilarity, and the weights. Finally, it determines spec-in or spec-out for the wafer. We will present experimental results that show how the proposed system is applied on the data acquired from semiconductor etching equipment.

Keywords: Monitoring; learning; prediction; matched pattern; Internet of Things; reference model (search for similar items in EconPapers)
Date: 2017
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Persistent link: https://EconPapers.repec.org/RePEc:sae:intdis:v:13:y:2017:i:7:p:1550147717721810

DOI: 10.1177/1550147717721810

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