Role of humidity and surface roughness on direct wafer bonding

B. N. J. Persson () and C. Mathew Mate ()
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B. N. J. Persson: Peter Grünberg Institute (PGI-1), Forschungszentrum Jülich
C. Mathew Mate: SLAC National Accelerator Laboratory

The European Physical Journal B: Condensed Matter and Complex Systems, 2024, vol. 97, issue 4, 1-13

Abstract: Abstract Bodies made from elastically stiff material usually bind very weakly unless the surfaces are flat and extremely smooth. In direct wafer bonding flat surfaces bind by capillary bridges and by the van der Waals interaction, which act between all solid objects. Here we study the dependency of the work of adhesion on the humidity and surface roughness in hydrophilic direct wafer bonding. We show that the long-wavelength roughness (usually denoted waviness) has a negligible influence on the strength of wafer bonding (the work of adhesion) from the menisci that form from capillary condensation of water vapor. Graphic abstract AFM surface topography for Si(100) wafer

Date: 2024
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DOI: 10.1140/epjb/s10051-024-00680-w

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