3D package-integrated artificial magnetic conductor antenna arrays for 60 GHz transceivers

Chryssoula A. Kyriazidou, Harry Contopanagos, Seunghwan Yoon, Anna Papió Toda, Franco De Flaviis, Jesus A. Castaneda and Nicolaos G. Alexopoulos

Journal of Electromagnetic Waves and Applications, 2016, vol. 30, issue 18, 2365-2389

Abstract: We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45° scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11 × 11 mm2 package area, has a measured gain of 17 dBi at broadside and 15 dBi at 45° scan angle, while the smaller array, occupying a 6.6 × 11 mm2 package area, has a gain of 15 dBi at broadside and 14 dBi at a 45° scan angle. These arrays are an ideal 3D-integrated package solution for 60 GHz radio transceivers.

Date: 2016
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DOI: 10.1080/09205071.2016.1250679

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