Experimental investigation and analysis of EMI in stacked I/O connectors of PCB

H.-H. Chou and Y.-S. Lee

Journal of Electromagnetic Waves and Applications, 2016, vol. 30, issue 2, 195-206

Abstract: The electromagnetic interference (EMI) caused by the noise resulting from a common mode of stacked I/O connectors is analyzed using both numerical simulation and experimental measurements. The use of stacked connectors exists on the PCBs of today’s information technology equipment in order to reduce size; however, size reductions will cause increased severe EMI. After diagnosis and analysis, a strategy is presented to suppress the EMI noise level, as well as its emissions, and is found to be very effective as shown by our experiments.

Date: 2016
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DOI: 10.1080/09205071.2015.1099477

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Journal of Electromagnetic Waves and Applications is currently edited by Mohamad Abou El-Nasr and Pankaj Kumar Choudhury

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