Testing process quality of wire bonding with multiple gold wires from viewpoint of producers

Tsang-Chuan Chang and Kuen-Suan Chen

International Journal of Production Research, 2019, vol. 57, issue 17, 5400-5413

Abstract: Wire bonding involves welding multiple gold wires to connect integrated circuits (ICs) to external circuits for power and signal transmission. Poor-quality wire bonding can prevent the IC and the electronic product from functioning effectively. In view of this, we developed a model to assess and control the quality of wire bonding with multiple gold wires from the viewpoints of both process and producers. We first analysed the consistency of wire bonding process performance. The Six Sigma quality index was then used to directly assess the quality of the wire bonding process and thereby examine its relationship with process yield. Furthermore, we derived the upper confidence limit of index $ {Q_{PLl}} $ QPLl by statistical inference, and used it to develop a testing model to ensure rigorous quality assessment. A real-world application in an IC packaging factory located in the Taichung Science Park, Taiwan, demonstrates the effectiveness of the proposed method.

Date: 2019
References: Add references at CitEc
Citations: View citations in EconPapers (4)

Downloads: (external link)
http://hdl.handle.net/10.1080/00207543.2018.1524164 (text/html)
Access to full text is restricted to subscribers.

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:taf:tprsxx:v:57:y:2019:i:17:p:5400-5413

Ordering information: This journal article can be ordered from
http://www.tandfonline.com/pricing/journal/TPRS20

DOI: 10.1080/00207543.2018.1524164

Access Statistics for this article

International Journal of Production Research is currently edited by Professor A. Dolgui

More articles in International Journal of Production Research from Taylor & Francis Journals
Bibliographic data for series maintained by Chris Longhurst ().