Reflow oven with Wi-Fi connectivity

Ovidiu-Andrei Barb ()
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Ovidiu-Andrei Barb: Computer Science and Electrical Engineering Department, “Lucian Blaga” University of Sibiu, Romania

International Journal of Advanced Statistics and IT&C for Economics and Life Sciences, 2024, vol. 14, issue 1, 157-167

Abstract: This paper will address a theme that highlights the role of an electrical equipment in the electrical industry, focusing on the process of soldering components onto the surface of printed circuit boards. The choice of the theme “Reflow Oven with Wi-Fi Connectivity” was driven by the desire to create a system with practical and applicative outcomes. The aim is to develop equipment that facilitates the soldering process of Surface Mounted Device (SMD) components. Such an automated system is valuable in the production of small batches of equipment, such as electronic modules for prototypes or various applications. The equipment or electronic module aims to depict a Printed Circuit Board (PCB) on which both Surface Mounted Devices (SMD) and Through Hole Technology (THT) components are mounted. Throughout the paper, the implementation of an automated system capable of carrying out the soldering process for SMD components will be discussed.

Keywords: IoT; reflow oven; Wi-Fi; soldering; PCB (search for similar items in EconPapers)
Date: 2024
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Persistent link: https://EconPapers.repec.org/RePEc:vrs:ijsiel:v:14:y:2024:i:1:p:157-167:n:1003

DOI: 10.2478/ijasitels-2024-0003

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