Influence of Bi on the Microstructure Evolution of Solder Joints in Microelectronics

Lechovič Emil, Szewczyková Beáta, Hodúlová Erika and Ulrich Koloman
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Lechovič Emil: Institute of Production Technology, Faculty of Materials Science and Technology in Trnava, Slovak University of Technology Bratislava, ul. J. Botu 25, 917 24 Trnava, Slovak Republic
Szewczyková Beáta: Institute of Production Technology, Faculty of Materials Science and Technology in Trnava, Slovak University of Technology Bratislava, ul. J. Botu 25, 917 24 Trnava, Slovak Republic
Hodúlová Erika: Institute of Production Technology, Faculty of Materials Science and Technology in Trnava, Slovak University of Technology Bratislava, ul. J. Botu 25, 917 24 Trnava, Slovak Republic
Ulrich Koloman: Institute of Production Technology, Faculty of Materials Science and Technology in Trnava, Slovak University of Technology Bratislava, ul. J. Botu 25, 917 24 Trnava, Slovak Republic

Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2010, vol. 18, issue 28, 17-23

Abstract: The aim of this article is study the influence of Bi on the microstructure evolution of lead-free solder joints in microelectronics. The key factors affecting the reliability of electronic products are the interfacial reactions in solder joints, the secondary products of which are brittle intermetallic compounds. Formation and growth of intermetallic compounds are dependent from the chemical composition of solder and base material, from the effects time of the moltent solder on the base material and from the operating temperature. It is very important to mention that these reactions occur not only near the contact of the base material and molten solder in the process of melting and cooling the soldered joint, but they continue even after the solder solidifies.

Keywords: soldering; lead-free solder; reliability; intermetallic compound; bismuth; soldering; lead-free solder; reliability; intermetallic compound; bismuth (search for similar items in EconPapers)
Date: 2010
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Persistent link: https://EconPapers.repec.org/RePEc:vrs:repfms:v:18:y:2010:i:28:p:17-23:n:2

DOI: 10.2478/v10186-010-0002-6

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