The Study Into the Ceramic-to-Metal Soldered Joints Interface for Al2O3 and SiO2 Materials

Koleňák Roman, Žúbor Peter, Koleňáková Monika and Provazník Martin
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Koleňák Roman: Institute of Production Technologies, Faculty of Materials Science of Technology in Trnava, Slovak university of Technology, Bratislava, ul. J. Bottu 25, 917 24 Trnava, Slovak Republic
Žúbor Peter: Inweld Consulting, s.r.o., Trnava
Koleňáková Monika: Institute of Production Technologies, Faculty of Materials Science of Technology in Trnava, Slovak university of Technology, Bratislava, ul. J. Bottu 25, 917 24 Trnava, Slovak Republic
Provazník Martin: Institute of Production Technologies, Faculty of Materials Science of Technology in Trnava, Slovak university of Technology, Bratislava, ul. J. Bottu 25, 917 24 Trnava, Slovak Republic

Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2010, vol. 18, issue 29, 29-37

Abstract: The conditions of joining a ceramic-metal configuration by active metal soldering using tin-based (SnTi3) alloys are presented. Active metal (Ti) was alloyed in a low concentration of 3 weight percent. The joining process was carried out in a vacuum (10-2 Pa) at a peak temperature of 860 °C with a short holding period (t = 9 min). The ceramic-metal soldered interface was examined using optical microscopy, scanning and transmission electron microscopy (SEM, TEM). The natures of the interfacial reactions and the reaction products were identified using X-ray diffraction (XRD). The thickness of reaction layers and X-ray maps of the same region were measured.

Keywords: active soldering; oxide ceramics; reaction layers; intermetallic compounds; fracture surface; active soldering; oxide ceramics; reaction layers; intermetallic compounds; fracture surface (search for similar items in EconPapers)
Date: 2010
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Persistent link: https://EconPapers.repec.org/RePEc:vrs:repfms:v:18:y:2010:i:29:p:29-37:n:3

DOI: 10.2478/v10186-010-0023-1

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