Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Prach Michal (), Kostolný Igor () and Koleňák Roman ()
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Koleňák Roman: Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, ul. Jána Bottu 25, 917 24 Trnava, Slovak Republic

Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2014, vol. 21, issue 34, 7

Abstract: The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM) CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl mechanical mixture was formed at the Al/ZnAl4 boundary. AgZn3 and Cu5Zn8 IM layers were formed at the Cu/ZnAg6Al6 boundary, and mechanical mixture of βZn-αAl and AgZn3 intermetallic mixture were formed at the boundary Al/ZnAg6Al6.

Date: 2014
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Persistent link: https://EconPapers.repec.org/RePEc:vrs:repfms:v:21:y:2014:i:34:p:7:n:8

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