The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder

Drienovský Marián (), Trnková Lýdia Rízeková (), Čička Roman (), Priputen Pavol (), Pekarčíková Marcela () and Janovec Jozef ()
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Drienovský Marián: Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science, Ulica Jána Bottu 2781/25, 917 24 Trnava
Trnková Lýdia Rízeková: Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science, Ulica Jána Bottu 2781/25, 917 24 Trnava
Čička Roman: Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science, Ulica Jána Bottu 2781/25, 917 24 Trnava
Priputen Pavol: Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science, Ulica Jána Bottu 2781/25, 917 24 Trnava
Pekarčíková Marcela: Slovak University Of Technology In Bratislava, Faculty Of Materials Science And Technology In Trnava, Institute Of Materials Science, Ulica Jána Bottu 2781/25, 917 24 Trnava
Janovec Jozef: Slovak University Of Technology In Bratislava, University Science Park, Vazovova 5, 812 43Bratislava

Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2018, vol. 26, issue 43, 33-44

Abstract: The influence of increased Cu and Ag contents on the microstructure evolution in the utilized Sn-0.3Ag-0.7Cu (wt. %) solder was studied. The utilized solder was exploited in the wave soldering process at the temperatures of about 260 °C for several days. The samples investigation involved the differential scanning calorimetry, the scanning electron microscopy including the energy dispersive X-ray spectroscopy, and the X-ray diffraction techniques. To predict phase equilibria at various temperatures and temperature dependences of heat capacity, the Thermo-Calc software and the COST531 lead-free solder database were used. The original and the utilized solders were found to be very similar regarding the phase occurrence, but slightly differ from one another in microstructure evolution due to higher bulk contents of Cu in the latter solder. The obtained results contribute to both the better understanding of the microstructure evolution in low-silver Sn-Ag-Cu solders and the determination of compositional limits for those solders used in the wave soldering process.

Keywords: Low-silver Sn–Ag–Cu solder; intermetallic compound; solidification; thermodynamic calculations (search for similar items in EconPapers)
Date: 2018
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Persistent link: https://EconPapers.repec.org/RePEc:vrs:repfms:v:26:y:2018:i:43:p:33-44:n:4

DOI: 10.2478/rput-2018-0028

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