STUDY OFCuDIFFUSION INCu/TaN/SiO2/SiMULTILAYER STRUCTURES

D. H. Zhang, S. W. Loh, C. Y. Li, P. D. Foo, Joseph Xie, R. Liu, A. T. S. Wee, L. Zhang and Y. K. Lee
Additional contact information
D. H. Zhang: School of Electrical and Electronic Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore
S. W. Loh: School of Electrical and Electronic Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore
C. Y. Li: Institute of Microelectronics, Science Park II, Singapore 117685, Singapore
P. D. Foo: Institute of Microelectronics, Science Park II, Singapore 117685, Singapore
Joseph Xie: Institute of Microelectronics, Science Park II, Singapore 117685, Singapore
R. Liu: Department of Physics, Lower Kent Ridge Road, Singapore 119260, Singapore
A. T. S. Wee: Department of Physics, Lower Kent Ridge Road, Singapore 119260, Singapore
L. Zhang: School of Applied Sciences, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore
Y. K. Lee: School of Applied Sciences, Nanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore

Surface Review and Letters (SRL), 2001, vol. 08, issue 05, 527-532

Abstract: This paper reports the effect of a flash copper layer, sandwiched between a copper film deposited by metal-organic chemical vapor deposition (MOCVD) and aTaNbarrier metal, on copper diffusion throughTaNbarrier to Si substrate after rapid thermal annealing at different temperatures. It is found that for the structure of CVDCu/TaN/SiO2/Si, which has no flashCulayer,Cucould diffuse through the 25-nm-thickTaNbarrier layer at an annealing temperature of 600°Cfor 180 s. However, by incorporating a flashCulayer between the CVDCufilm and theTaNbarrier,Cudiffusion can be significantly reduced. In addition toCu, the out-diffusion of Si and oxygen, and the interaction between them can also be reduced by the incorporated flashCulayer, due likely to the change of the crystallographic orientation of the CVDCufilms.

Date: 2001
References: Add references at CitEc
Citations:

Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X01001270
Access to full text is restricted to subscribers

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:08:y:2001:i:05:n:s0218625x01001270

Ordering information: This journal article can be ordered from

DOI: 10.1142/S0218625X01001270

Access Statistics for this article

Surface Review and Letters (SRL) is currently edited by S Y Tong

More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().