INVESTIGATION OF THE INTERFACE OF THE DCB SUBSTRATE

Honglong Ning, Usheng Ma, Fuxiang Huang, Yonggang Wang, Jiman Zhu and Zhiting Geng
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Honglong Ning: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China
Usheng Ma: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China
Fuxiang Huang: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China
Yonggang Wang: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China
Jiman Zhu: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China
Zhiting Geng: Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China

Surface Review and Letters (SRL), 2003, vol. 10, issue 01, 95-99

Abstract: DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al2O3ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface.

Keywords: Interface; direct copper bonding (DCB); Cu–Cu2O eutectic solution (search for similar items in EconPapers)
Date: 2003
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DOI: 10.1142/S0218625X03004640

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