Intermetallic Formation in the Aluminum–Copper System

E. B. Hannech, N. Lamoudi, N. Benslim and B. Makhloufi
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E. B. Hannech: Département de Physique, LESIMS, Université de Annaba, BP 12, Annaba, Algeria
N. Lamoudi: Département de Physique, LESIMS, Université de Annaba, BP 12, Annaba, Algeria
N. Benslim: Département de Physique, LESIMS, Université de Annaba, BP 12, Annaba, Algeria
B. Makhloufi: Département de Physique, LESIMS, Université de Annaba, BP 12, Annaba, Algeria

Surface Review and Letters (SRL), 2003, vol. 10, issue 04, 677-683

Abstract: Intermetallic formation at 425°C in the aluminum–copper system has been studied by scanning electron microscopy using welded diffusion couples. Several Al–Cu phases predicted by the equilibrium phase diagram of the elements and voids taking place in the diffusion zone have been detected in the couples. The predominant phases were found to beAl2Cu3and the solid solution of Al in Cu, α. The growth of the intermetallic layer obeyed the parabolic law.

Keywords: Intermetallics; growth kinetics; Al–Cu system; interdiffusion (search for similar items in EconPapers)
Date: 2003
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DOI: 10.1142/S0218625X03005396

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