GROWTH KINETICS OFCu(Al)SOLID SOLUTION INAl/CuDIFFUSION COUPLES

E. B. Hannech, N. Lamoudi and A. Gasmi
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E. B. Hannech: Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria
N. Lamoudi: Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria
A. Gasmi: Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria

Surface Review and Letters (SRL), 2004, vol. 11, issue 03, 337-340

Abstract: The growth kinetics of the solid solution phase of aluminum in copper in diffusion couples of pure aluminum and copper has been investigated at 425°C using a scanning electron microscope. In the initial stage, the phase layer growth was found to obey the parabolic law, indicating that the rate-controlling process is diffusion. At longer times, the growth rate deviates from thekt-1/2behavior of the early stage.

Keywords: Interdiffusion; growth kinetics; diffusion reactions (search for similar items in EconPapers)
Date: 2004
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DOI: 10.1142/S0218625X04006232

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