STUDY OF A BIMATERIAL SYSTEM BY AN IMPROVED DYNAMICAL THERMAL MODEL

A. I. Oliva (), R. D. Maldonado, O. Ceh, J. E. Corona and H. G. Riveros
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A. I. Oliva: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, México
R. D. Maldonado: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, México
O. Ceh: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, México
J. E. Corona: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, México
H. G. Riveros: Instituto de Física, UNAM, A.P. 20-364, 01000 México D.F., México

Surface Review and Letters (SRL), 2005, vol. 12, issue 02, 289-298

Abstract: We present an improved dynamical thermal model and the corresponding experimental efforts to determine thermal profiles of thin metallic films deposited on thick substrates (bimaterial system) as are usually used in microelectronics. A dynamical thermal model to characterize the Joule heating of a metallic film/substrate system, as a function of the applied energy and the thickness is discussed. Good agreement between theoretical and measured thermal profiles on different bimaterial systems support the theoretical model obtained by solving a harmonic oscillator equation. By combining the thermal model and the experimental results it is possible to determine the convective coefficient of the room conditions, the diffusive time constant, and to quantify the different mechanisms of heat loss as a function of the physical properties and the geometrical parameters. The improved thermal model can be useful to rapidly predict a thermal behavior of film/substrate systems that are used for microelectronics.

Keywords: Bimaterial; thin metallic film; thermal model; convective coefficient; 81.70.P; 68.60.D; 72.15.Eb (search for similar items in EconPapers)
Date: 2005
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DOI: 10.1142/S0218625X05007025

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