PHYSICAL PROPERTIES OBTAINED FROM MEASURED THERMAL PROFILES IN THE FILM/SUBSTRATE BIMATERIAL SYSTEM

R. D. Maldonado, A. I. Oliva () and H. G. Riveros ()
Additional contact information
R. D. Maldonado: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, Mexico
A. I. Oliva: Centro de Investigación y de Estudios Avanzados del IPN, Unidad Mérida, Depto. de Física Aplicada, Km. 6 Ant. Carr. Progreso, A.P. 73-Cordemex, 97310 Mérida Yucatán, Mexico
H. G. Riveros: Instituto de Física, UNAM, A.P. 20-384, 01000, México D.F., Mexico

Surface Review and Letters (SRL), 2006, vol. 13, issue 05, 557-565

Abstract: The microelectronic devices are formed by a substrate that supports the functional thin film material. The thermal, electrical, and mechanical properties of the system depend strongly on the interfacial properties between a film and a substrate. The interfacial nature in a film/substrate system originates the thermal contact resistance(Rtc). We discuss the thermal and the electrical behavior in a film/substrate system (bimaterial system) making emphasis on theRtcof the interface.Au/glass samples with different thicknesses were prepared by thermal evaporation for experimentation. The bimaterial system was heated by a DC electrical current to obtain thermal profiles. Film and substrate thermal profiles acquired with high resolution combined with a developed bimaterial model are used as an alternative method to estimate theRtcvalue at atmospheric pressure, the electrical resistivity ρ, and the thermal resistive coefficientαrin the bimaterial system. The calculatedRtcvalues ranged from 7.7 × 10-4to 1.2 × 10-3m2K/W for theAu/glass system, in good agreement with previously reported values. The ρ values obtained from the thermal profile data present a more reliable value due to the global character than the local values measured by the four-probe technique. Dependence on film thickness was also found in theαrcoefficient determination.

Keywords: Thermal resistance; metallic films; bimaterial system; electrical resistivity (search for similar items in EconPapers)
Date: 2006
References: View complete reference list from CitEc
Citations:

Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X06008499
Access to full text is restricted to subscribers

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:13:y:2006:i:05:n:s0218625x06008499

Ordering information: This journal article can be ordered from

DOI: 10.1142/S0218625X06008499

Access Statistics for this article

Surface Review and Letters (SRL) is currently edited by S Y Tong

More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().