PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION

Eun Sun Ji, Young Hwan Kim, Yong Cheol Kang, Young Soo Kang and Byung Hyun Ahn
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Eun Sun Ji: Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea
Young Hwan Kim: Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea
Yong Cheol Kang: Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea
Young Soo Kang: Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea
Byung Hyun Ahn: School of Material Science and Engineering, Pukyong National University, San 100, Yongdang-Dong, Nam-Gu, Busan 608739, Korea

Surface Review and Letters (SRL), 2007, vol. 14, issue 04, 593-596

Abstract: This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activatedAgthin film was developed on this surface using 0.1 MAgNO3. TheCulayers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology ofCulayers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.

Date: 2007
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DOI: 10.1142/S0218625X07009724

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