EFFECT OF SLOW HEATING AND COOLING ON THE INTERDIFFUSION OF THIN FILMS

H. D. Joubert, J. J. Terblans and H. C. Swart ()
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H. D. Joubert: Department of Physics, University of the Free State, P. O. Box 339, Bloemfontein, ZA-9300, South Africa
J. J. Terblans: Department of Physics, University of the Free State, P. O. Box 339, Bloemfontein, ZA-9300, South Africa
H. C. Swart: Department of Physics, University of the Free State, P. O. Box 339, Bloemfontein, ZA-9300, South Africa

Surface Review and Letters (SRL), 2007, vol. 14, issue 04, 703-707

Abstract: Interdiffusion parameters are often extracted from depth profiles of the interface of annealed thin films by measuring the annealing time of the sample as well as the distance over which interdiffusion took place. The annealing time is usually taken as the time from the moment the sample enters the oven to the exact moment the sample is removed from the oven. However, diffusion does not start and stop at these points, as the temperature of the sample does not change instantaneously. Any calculation performed with the instantaneous and therefore erroneous time will result in incorrect diffusion parameters extracted from the depth profiles. The influence of the extended heating period is studied by solving Fick's second law numerically and employing three distinct heating profiles in the calculations, namely instantaneous, actual, and linear. The results indicate a clear difference between the first two calculated depth profiles. Using these calculations and some experimental results, a method that employs linear heating and cooling of a sample is proposed for studying the interdiffusion of fast diffusing elements (with low activation energies).

Keywords: Diffusion parameters; thin films; interdiffusion calculations; diffusion profile (search for similar items in EconPapers)
Date: 2007
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DOI: 10.1142/S0218625X07009967

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