MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER

Jeong-Won Yoon, Hyun-Suk Chun, Han-Byul Kang, Min-Ho Park, Cheol-Woong Yang, Hoo-Jeong Lee and Seung-Boo Jung ()
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Jeong-Won Yoon: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Hyun-Suk Chun: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Han-Byul Kang: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Min-Ho Park: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Cheol-Woong Yang: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Hoo-Jeong Lee: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
Seung-Boo Jung: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea

Surface Review and Letters (SRL), 2007, vol. 14, issue 04, 827-832

Abstract: We studied the growth kinetics and characteristics of electroless nickel–phosphorus (EN–P) deposition layer onCusubstrate in an acid plating bath with sodium hypophosphite as the reducing agent. The individual nodules of the EN–P layer increased in size but decreased in number with increasing plating time and pH, i.e. the root-mean-square (RMS) roughness of the EN deposit decreased. In addition, the plating rate of the EN layer increased with increasing plating bath pH. X-ray diffraction (XRD) analyses revealed that the as-plated deposit was in an amorphous phase, while the heat-treated layer was composed of crystallizedNiandNi3Pcompound. The solderability of the EN layer increased with decreasingPcontent. In addition, the wetting force increased with increasing surface roughness. The present study clearly showed that the solderability behavior of the EN layer is affected by both surface composition (Pcontent) and morphology.

Keywords: Electroless nickel-phosphorus plating; surface morphology; solderability (search for similar items in EconPapers)
Date: 2007
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DOI: 10.1142/S0218625X07010111

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