SURFACE MODIFICATION OF PLASMA TREATMENT ONSiO2LAYER WITH UNDERFILL

Bo-In Noh and Seung-Boo Jung ()
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Bo-In Noh: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea
Seung-Boo Jung: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea

Surface Review and Letters (SRL), 2007, vol. 14, issue 04, 849-852

Abstract: The plasma treatment onSiO2substrate surfaces increased the oxygen-containing functional groups or the polar component of the surface free energy and, the wetting characteristics of the underfills/SiO2. The plasma treatment condition which gave the smallest contact angle between the underfills andSiO2was an operating time of 60 sec underO2gas atmosphere and a power of 200 W.

Keywords: Plasma treatment; silicon oxide; surface modification; underfill (search for similar items in EconPapers)
Date: 2007
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DOI: 10.1142/S0218625X07010160

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