DC CONDUCTION MECHANISMS INAl–SnO2–AlSTRUCTURE DEPOSITED BY THERMAL EVAPORATION
M. Anwar (),
I. M. Ghauri,
S. A. Siddiqi and
Naveed Afzal
Additional contact information
M. Anwar: Physics Department, Government College, Burewala, Pakistan
I. M. Ghauri: Centre for Advanced Studies in Physics, G. C. University, Lahore, Pakistan
S. A. Siddiqi: Centre for Solid State Physics, University of the Punjab, Lahore, Pakistan
Naveed Afzal: Centre for Advanced Studies in Physics, G. C. University, Lahore, Pakistan
Surface Review and Letters (SRL), 2008, vol. 15, issue 03, 207-216
Abstract:
The DC conduction mechanisms in metal–insulator–metal sandwich structure based on amorphous thin films ofSnO2have been studied in the thickness range 100–400 nm, in the substrate temperature range 293–543 K, and in the annealing temperature range 473–773 K, and the results are discussed in terms of current theory. It is observed that at low field and low temperature the conduction mechanism is found to obey the hopping model, at higher temperature the conduction takes place by transport in the extended states but at high field the main barrier lowering effect is associated with localized centers. The increase in electrical conductivity with film thickness is caused by the oxygen vacancies and${\rm SnO}_{2-x}({\rm V}_{\rm \ddot{O}})_{x}\, {\rm e}_{2x}^\prime$defects which generate carriers in the films. The increase in electrical conductivity due to an increase in substrate temperature is ascribed to the increasing concentration of ionized donors and hoping of electrons between metal ions in two different valence states. The formation of tin species of lower valence states and doubly ionized oxygen vacancies are thought to be responsible for the increase in electrical conductivity at higher annealing temperature.
Keywords: SnO2amorphous thin films; structural defects; activation energy; tin interstitial; oxygen vacancies; conductivity; Poole–Frenkel effect; 73.40. Rw; 73.61. Jc; 73.50. –h (search for similar items in EconPapers)
Date: 2008
References: View complete reference list from CitEc
Citations:
Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X08011251
Access to full text is restricted to subscribers
Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.
Export reference: BibTeX
RIS (EndNote, ProCite, RefMan)
HTML/Text
Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:15:y:2008:i:03:n:s0218625x08011251
Ordering information: This journal article can be ordered from
DOI: 10.1142/S0218625X08011251
Access Statistics for this article
Surface Review and Letters (SRL) is currently edited by S Y Tong
More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().