MEASUREMENTS OF SOLID–LIQUID INTERFACIAL ENERGIES IN THE ORGANIC MONOTECTIC ALLOYS
U. Böyük,
K. Yüceer,
K. Keşlioğlu,
A. Ulgen and
N. Maraşli ()
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U. Böyük: Education Faculty, Department of Science Education, Erciyes University, 38039 Kayseri, Turkey
K. Yüceer: Institute of Science and Technology, Department of Physics, Erciyes University, 38039 Kayseri, Turkey
K. Keşlioğlu: Faculty of Arts and Sciences, Department of Physics, Erciyes University, 38039 Kayseri, Turkey
A. Ulgen: Faculty of Arts and Sciences, Department of Chemistry, Erciyes University, 38039 Kayseri, Turkey
N. Maraşli: Faculty of Arts and Sciences, Department of Physics, Erciyes University, 38039 Kayseri, Turkey
Surface Review and Letters (SRL), 2009, vol. 16, issue 02, 203-214
Abstract:
The commercial purity dibromobenzene (DBB) and succinonitrile (SCN) were purified using a columnar distillation system. Thin walled rectangular specimen cells (60–80 μm thick) were fabricated and filled with the purified materials under the vacuum. The specimen cell was placed in a horizontal temperature gradient stage. A thin liquid layer was melted and the specimen was annealed in a constant temperature gradient for an enough time to observe the equilibrated grain boundary groove shapes. The thermal conductivities of solid and liquid phases for the purified DBB and DBB–5.7 mol% SCN alloy were determined with the radial heat flow and the Bridgman-type growth apparatuses. From the observed grain boundary groove shapes, the Gibbs–Thomson coefficients, solid–liquid interfacial energies, and the grain boundary energies for solid DBB in equilibrium with its melts and solid DBB in equilibrium with DBB–SCN monotectic liquid have been determined. The temperature coefficients of the purified DBB and DBB–5.7 mol% SCN alloy were also determined from thermal conductivity curve vs temperature.
Keywords: Organic materials; crystal growth; interfacial energy; grain boundary energy; thermal conductivity (search for similar items in EconPapers)
Date: 2009
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Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:16:y:2009:i:02:n:s0218625x09012500
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DOI: 10.1142/S0218625X09012500
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