EXPERIMENTAL OBSERVATIONS OF ORDERLY STRUCTURES IN COPPER FILMS DEPOSITED ON LIQUID SUBSTRATES

Miao-Gen Chen (), Sen-Jiang Yu, Yuan-Xin Feng, Zhi-Wei Jiao and Bo Yang
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Miao-Gen Chen: Department of Physics, China Jiliang University, Hangzhou 310018, China
Sen-Jiang Yu: Department of Physics, China Jiliang University, Hangzhou 310018, China
Yuan-Xin Feng: College of Science, Zhejiang University of Science and Technology, Hangzhou 310023, China
Zhi-Wei Jiao: Department of Physics, China Jiliang University, Hangzhou 310018, China
Bo Yang: Department of Physics, Zhejiang University, Hangzhou 310027, China

Surface Review and Letters (SRL), 2009, vol. 16, issue 03, 359-365

Abstract: In this paper, an optical microscopy study of orderly structures, namely bands, which are observed in a nearly free sustained copper(Cu)film system, is presented. The band is composed of a large number of parallel key-formed domains with different widthwbut nearly uniform lengthL. This study shows that the morphologies of theCufilms are very susceptible to the deposition rate, i.e. with the increase in the deposition ratef, the bands with rectangular domains first become irregular gradually and then disappear completely. The experiment indicates that the growth mechanism of the orderly patterns can be explained in terms of the relaxation of the internal stress in the films, which is related to the characteristic boundary condition of the films on the liquid substrates and the nearly zero adhesion of the solid–liquid interface.

Keywords: Orderly structure; thin film; liquid substrate; internal stress; 62.40.+i; 68.55.-a; 68.90.+g (search for similar items in EconPapers)
Date: 2009
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DOI: 10.1142/S0218625X0901272X

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