STUDY OF ELECTRICAL CONDUCTIVITY FOR COPPER NANOPARTICLES WITH VAPOR-DEPOSITED SAMs

Gye-Young Lee, Mi-Ryn Seong, Jinhyeong Kwon, Dong-Kwon Kim, Caroline Sunyong Lee (), Gi-Ra Yi and Young-Seok Kim
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Gye-Young Lee: Division of Materials and Chemical Engineering, Hanyang University, Gyeonggi-do 426-791, Korea
Mi-Ryn Seong: Division of Materials and Chemical Engineering, Hanyang University, Gyeonggi-do 426-791, Korea
Jinhyeong Kwon: Division of Materials and Chemical Engineering, Hanyang University, Gyeonggi-do 426-791, Korea
Dong-Kwon Kim: Division of Materials and Chemical Engineering, Hanyang University, Gyeonggi-do 426-791, Korea
Caroline Sunyong Lee: Division of Materials and Chemical Engineering, Hanyang University, Gyeonggi-do 426-791, Korea
Gi-Ra Yi: Korea Basic Science Institute, Daejeon, 305-333, Korea
Young-Seok Kim: Korea Electronics Technology Institute, Gyeonggi-do 463-816, Korea

Surface Review and Letters (SRL), 2009, vol. 16, issue 04, 519-523

Abstract: A self-assembled monolayer (SAM) of octanethiol was vapor-deposited onto the surface of copper (Cu) nanoparticles as a means of preventing oxidation. The presence of octanethiol on the surface ofCunanoparticles was verified using Fourier transform infrared spectroscopy and transmission electron microscopy. The electrical resistance of copper nanoparticles with deposition of a 12-nm thickness of octanethiol on the surface was found to be 100 times greater than that of uncoated powders, indicating uniform SAM coating of the particles.

Keywords: Self-assembled monolayer (SAM); copper nanoparticles; octanethiol; conductivity (search for similar items in EconPapers)
Date: 2009
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DOI: 10.1142/S0218625X09013098

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