DEVELOPMENT OF HIGH STRENGTH AND HIGH CONDUCTIVITYCu–AgALLOY FOR MEDICAL ULTRASOUND EQUIPMENT
Hoon Cho (),
Byoung-Soo Lee and
Hyung-Ho Jo
Additional contact information
Hoon Cho: Korea Institute of Industrial Technology, 7-47 Sondo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Byoung-Soo Lee: Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Aoba-Ku, Sendai 980-8577, Japan
Hyung-Ho Jo: Korea Institute of Industrial Technology, 7-47 Sondo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Surface Review and Letters (SRL), 2010, vol. 17, issue 01, 93-97
Abstract:
The effect of thermal heat treatment on the mechanical and electrical properties ofCu–Agalloys was investigated. The homogenization heat treatment leads to an increase in tensile strength and a decrease in electrical conductivity due to dissolution ofAginto copper matrix. Also, it is shown that electrical conductivity of as-castCu–Agalloys decreases with increasingAgcontent. In contrast, the aging heat treatment gives rise to increase both the tensile strength and electrical conductivity because theAgsolute diffuses out from copper matrix during aging heat treatment. Therefore, it can be mentioned that the electrical conductivity ofCu–Agalloys depends onAgsolute in copper matrix. Also, aging treatment is favorable to acquire high strength and high electrical conductivity.
Keywords: High strength and high conductivity; micro-multicable; ultrasonic diagnostic; solid solution; aging (search for similar items in EconPapers)
Date: 2010
References: View complete reference list from CitEc
Citations:
Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X10013953
Access to full text is restricted to subscribers
Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.
Export reference: BibTeX
RIS (EndNote, ProCite, RefMan)
HTML/Text
Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:17:y:2010:i:01:n:s0218625x10013953
Ordering information: This journal article can be ordered from
DOI: 10.1142/S0218625X10013953
Access Statistics for this article
Surface Review and Letters (SRL) is currently edited by S Y Tong
More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().