SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Yue-Seon Shin, Young-Ki Ko, Jun-Ki Kim, Sehoon Yoo () and Chang-Woo Lee ()
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Yue-Seon Shin: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Young-Ki Ko: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Jun-Ki Kim: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Sehoon Yoo: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea
Chang-Woo Lee: Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea

Surface Review and Letters (SRL), 2010, vol. 17, issue 02, 201-205

Abstract: SiC-mixedSn–58Bicomposite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersedSiCnanoparticles were added to the plating solutions. DSC analysis indicated that the melting temperature ofSiC-mixedSn–58Bisolders was the same as that of the non-mixedSn–58Bi. Shear strengths ofSn–58Bi+SiCsolder bumps were 6% higher than that of non-mixed solder bumps. The thicknesses of intermetallic compound were almost the same for bothSn–58BiandSn–58Bi+SiCsamples. TheSn–58Bi+SiCcomposite solder bumps had finer lamellar structures than non-mixedSn–58Bi. From the fracture surface analysis, fracture occurred at solder bump matrix, not at joint interface. Therefore, the addition of theSiCnanoparticles in theSn–58Bisolders decreased the grain sizes, which increased the shear strengths.

Keywords: Sn–58Bi; SiCnanoparticles; Pb-free solders; solder bump; electroplating (search for similar items in EconPapers)
Date: 2010
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DOI: 10.1142/S0218625X10013795

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