COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS

Minggang Li, Guoying Wei (), Jianfang Wang, Meng Li, Xixi Zhao and Yuze Bai
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Minggang Li: College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China
Guoying Wei: College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China
Jianfang Wang: College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China
Meng Li: College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China
Xixi Zhao: College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China
Yuze Bai: Environmental Monitoring Station of Yangquan, Shanxi Province, P. R. China

Surface Review and Letters (SRL), 2014, vol. 21, issue 01, 1-7

Abstract: Non-cyanide alkaline bath was used to prepare copper thin films. Influences of various temperatures on deposition rates, surface morphologies and microstructures of films were investigated. Copper thin films prepared from non-cyanide alkaline bath show typical nodular structures. Copper films fabricated at higher temperature possess rough surface due to hydrolysis of complexing agents. According to the XRD patterns, all deposited films were crystalline and showedCu(111),Cu(200) andCu(220) peaks. The intensity of peak (200) increases gradually with the rise on bath temperatures. Films with maximum thickness (7.5 μm) could be obtained at the temperature of 40°C. From the cyclic voltammetry curve, it was found that the cathodic polarization decreased slightly with increase of bath temperatures. In addition, when the bath temperature was equal to 50°C, current efficiency could reach to 96.95%.

Keywords: Bath temperature; films; electrodeposition (search for similar items in EconPapers)
Date: 2014
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DOI: 10.1142/S0218625X14500097

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