EFFECT OF ULTRASONIC ON COPPER ELECTROPLATING FROM THE NON-CYANIDE ALKALINE BATHS

Minggang Li, Shuangshuang Hu, Yejiong Yang, Shuhan Xu, Xixi Zhao and Guoying Wei ()
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Minggang Li: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China
Shuangshuang Hu: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China
Yejiong Yang: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China
Shuhan Xu: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China
Xixi Zhao: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China
Guoying Wei: College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China

Surface Review and Letters (SRL), 2014, vol. 21, issue 04, 1-6

Abstract: Effects of the different ultrasonic powers on copper electrodeposition from non-cyanide alkaline baths by using pyrophosphate as complexing agent were investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements were used to characterize the nucleation and growth mechanism. It is very obvious that the reduction potential moves to more positive one as the ultrasonic power increases. The quartz crystal microbalance (QCM) and chronoamperometric method were used to study the relationship between the mass change and the deposition time. It was found that the current efficiency of electrolyte under 0, 60, 80 and 100 W is 91.95%, 92.14%, 89.25% and 96.11%, respectively measured by QCM measurements. The surface morphology of the electrodepositedCufilms is analyzed by scanning electron microscopy (SEM). The morphology of copper films electrodeposited under the power of 60 W and 80 W presents a compact surface and the grains are fine and uniform.

Keywords: Cuthin film; electrochemical methods; quartz crystal microbalance; ultrasonic (search for similar items in EconPapers)
Date: 2014
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DOI: 10.1142/S0218625X14500577

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