INTERMETALLIC COMPOUND FORMATION IN Ni/Sn DIFFUSION COUPLE AT ATMOSPHERIC AND AT 10−8 ATMOSPHERE PRESSURE

N. Adioui, E. B. Hannech, W. Guergueb and M. Bououdina
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N. Adioui: LESIMS, Department of Physics, Badji Mokhtar Annaba University, Annada 23000, Algeria
E. B. Hannech: LESIMS, Department of Physics, Badji Mokhtar Annaba University, Annada 23000, Algeria
W. Guergueb: LESIMS, Department of Physics, Badji Mokhtar Annaba University, Annada 23000, Algeria
M. Bououdina: #x2020;Department of Physics, College of Science, University of Bahrain, P. O. Box 32038, Kingdom of Bahrain

Surface Review and Letters (SRL), 2017, vol. 24, issue Supp02, 1-9

Abstract: The microstructure resulting from diffusion reactions, at solid-state temperatures, in Ni/Sn couples has been studied by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The Ni3Sn4 phase was the only reaction product which formed in the couples at temperatures from 150∘C to 220∘C. The growth kinetics of Ni3Sn4 layer followed the parabolic law with an apparent activation energy of 104kJmol−1. The effect of the atmosphere on the microstructure of the interfacial layer was investigated at 220∘C for a pressure of 10−8atm. A decrease in the growth rate of the phase layer was observed.

Keywords: Intermetallic compound; growth kinetics; interdiffusion; diffusion couple; activation energy (search for similar items in EconPapers)
Date: 2017
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DOI: 10.1142/S0218625X18500233

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