EVALUATION ON THE THERMAL AND STRUCTURAL PROPERTIES OF COPPER ALUMINUM OXIDE (Cu-Al2O3) THIN FILM ON AL SUBSTRATE: EFFECT OF ANNEALING TEMPERATURE

Wei Qiang Lim (), Subramani Shanmugan () and Mutharasu Devarajan ()
Additional contact information
Wei Qiang Lim: Nano Optoelectronics and Research Laboratory, School of Physics, Universiti Sains Malaysia (USM), 11800, Minden, Penang, Malaysia
Subramani Shanmugan: Nano Optoelectronics and Research Laboratory, School of Physics, Universiti Sains Malaysia (USM), 11800, Minden, Penang, Malaysia
Mutharasu Devarajan: Nano Optoelectronics and Research Laboratory, School of Physics, Universiti Sains Malaysia (USM), 11800, Minden, Penang, Malaysia

Surface Review and Letters (SRL), vol. 25, issue 07, 1-8

Abstract: Layer stacking technique is incorporated in the deposition of copper aluminium oxide (Cu-Al2O3) thin films on Al substrate using RF magnetron sputtering. The Cu/Al2O3 stack is sputtered using Cu and Al2O3 target at ambient temperature and then annealed to yield the resultant Cu-Al2O3 films. The structural properties of the films are investigated through X-ray Diffraction (XRD) whereas the chemical structure of the films is studied using Fourier-transform infrared (FTIR). The thermal conductivity analyzer is used to evaluate the thermal properties of coated film on the Al substrate. XRD analysis revealed that the synthesized films are polycrystalline film composed mainly of CuAl2O4 phase along with Al2O3 and CuO phases. The thermal properties of Cu-Al2O3 coated Al substrates showed improvement in terms of thermal conductivity and diffusivity compared to bare Al substrate. The Cu-Al2O3 sample annealed at 400∘C exhibited a significant difference in thermal conductivity (Δk=11W/mK) compared to bare Al. The difference in thermal conductivity displayed by the annealed sample verified that TIMs did enhance the thermal path of entire substrate by allowing the heat to dissipate to surrounding environment more efficiently, thereby improving the heat dissipation system. From the results observed, it can be concluded that Cu-Al2O3 coated Al substrate can be made as alternative TIM in thermal management application.

Keywords: Thermal conductivity; Cu-Al2O3; FTIR; thin films; structural (search for similar items in EconPapers)
References: Add references at CitEc
Citations:

Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X19500173
Access to full text is restricted to subscribers

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:25:y::i:07:n:s0218625x19500173

Ordering information: This journal article can be ordered from

DOI: 10.1142/S0218625X19500173

Access Statistics for this article

Surface Review and Letters (SRL) is currently edited by S Y Tong

More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().