PREPARATION OF Cu-SiO2/PA12 COMPOSITE POWDERS BY ELECTROLESS PLATING FOR USE IN SLS PROCESSING

Chengmei Gui, Zhenming Chen, Chenguang Yao and Guisheng Yang
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Chengmei Gui: School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, Anhui 23009, P. R. China
Zhenming Chen: #x2020;Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization, College of Materials and Environmental Engineering, Hezhou University, Hezhou, Guangxi 542899, P. R. China
Chenguang Yao: #x2021;Shanghai Genius Advanced Material Co., Ltd, Shanghai 201109, P. R. China
Guisheng Yang: School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, Anhui 23009, P. R. China‡Shanghai Genius Advanced Material Co., Ltd, Shanghai 201109, P. R. China§Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, P. R. China

Surface Review and Letters (SRL), 2019, vol. 26, issue 09, 1-8

Abstract: In this work, SiO2-encapsulated copper particles/PA12 (Cu-SiO2/PA12) composite powders were prepared by electroless composite plating, and the laser sintering behavior was investigated. Results showed that Cu, Cu2O, CuO, and SiO2 (Cu-SiO2) composite particles were plated on the surface of KH550-modified PA12 powders. The Cu-SiO2 particles existed independently on PA12 surface, and the size was around 200 nm. The melting temperature and crystallization temperature of Cu-SiO2/PA12 composite powders were 183∘C and 150∘C. The results indicate that the selective laser sintering (SLS) process involved the contact of Cu-SiO2/PA12 powders, the formation of sintering neck, the growth of sintering neck, and the formation of fused solid. The Cu-SiO2 composite particles uniformly dispersed in the part due to surface tension, and the contact interface was good due to their similar polarity. The Cu-SiO2/PA12 SLS parts had excellent dimensional precision. The tensile strength of the 15W-sintered Cu-SiO2/PA12 specimen was 48MPa.

Keywords: Nylon 12 powders; electroless composite plating; silicon dioxide; copper (search for similar items in EconPapers)
Date: 2019
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DOI: 10.1142/S0218625X19500550

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