THE STUDY ON THE O2 PLASMA TREATMENT FOR BONDING OF SU-8 LAYERS

Xue Yang, Xinyan Jiang, Zhifu Yin, Dong F. Wang, Tengfei Yu, Lei Sun and Helin Zou
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Xue Yang: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Xinyan Jiang: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Zhifu Yin: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Dong F. Wang: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Tengfei Yu: #x2020;Tangshan Research Institute Co., Ltd., China Coal Science and Engineering Group, Tangshan 063012, P. R. China
Lei Sun: #x2021;Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology, Dalian 116024, P. R. China
Helin Zou: #x2021;Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology, Dalian 116024, P. R. China

Surface Review and Letters (SRL), 2020, vol. 27, issue 03, 1-9

Abstract: SU-8 is becoming increasingly important for fabrication of lab-on-a-chip devices due to its excellent chemical stability, mechanical, and optical properties. To form a complete SU-8 device, O2 plasma-assisted thermal bonding has been used to bond SU-8 layers. O2 plasma treatment is critical and has a significant influence on the fabrication quality of SU-8 devices. However, to the best of our knowledge, there is no work which analyzed O2 plasma treating process for SU-8 material in depth and systematically. In this study, the influence of O2 plasma treatment on the water contact angle and bonding strength for both un-crosslinked and crosslinked SU-8 layer was investigated in detail. The etching effect of SU-8 layer was also studied. The leakage test demonstrated that there is no gas leakage in the bonded SU-8 layer up to 0.65Mpa which indicates the practicability of the proposed SU-8 bonding method.

Keywords: SU-8; thermal bonding; O2 plasma treatment; water contact angle (search for similar items in EconPapers)
Date: 2020
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DOI: 10.1142/S0218625X19501191

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