NUMERICAL STUDY ON BONDING OF PMMA NANOCHANNELS
Xue Yang,
Kai Chen,
Zhifu Yin,
Helin Zou and
Tengfei Yu
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Xue Yang: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Kai Chen: #x2020;School of Mechanical Engineering, Liaoning Technical University, Fuxin 123000, P. R. China
Zhifu Yin: School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, P. R. China
Helin Zou: #x2021;Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology, Dalian 116024, P. R. China
Tengfei Yu: #xA7;Tangshan Research Institute Co., Ltd., China Coal Science and Engineering Group, Tangshan 063012, P. R. China
Surface Review and Letters (SRL), 2020, vol. 27, issue 09, 1-6
Abstract:
Polymethyl Methacrylate (PMMA) nanochannels are becoming increasingly important for biological, optical and electronic applications. To form a complete PMMA nanochannel/device, the open nanotrench will always be thermal bonded. However, the bonding process which influences the final fabrication precision of PMMA devices has not yet been studied systematically by numerical simulation. In this work, an elastic–plastic model was used for PMMA nanochannel bonding. The influence of temperature, pressure, aspect ratio, and friction coefficient on the dimension loss and max stress was studied systematically. By numerical simulation, all the main influence factors were optimized. It is expected that the proposed simulation method has a high potential for the polymer bonding process analysis.
Keywords: PMMA; thermal bonding; numerical simulation; dimension loss; max stress (search for similar items in EconPapers)
Date: 2020
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DOI: 10.1142/S0218625X19502135
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