Cu–W FILM STRUCTURE INFLUENCED BY Ar+ ENERGY AND LOW-ENERGY BEAM FLOW BOMBARD DURING PREPARATION BY TWO-ION-BEAM SPUTTERING

Yong-Ping Ai and Shi-Kun Xie
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Yong-Ping Ai: New Low-Carbon Green Building Materials Institute, Electromechanical Engineering College, Jinggangshan University, Ji’an, Jiangxi 343009, P. R. China
Shi-Kun Xie: New Low-Carbon Green Building Materials Institute, Electromechanical Engineering College, Jinggangshan University, Ji’an, Jiangxi 343009, P. R. China

Surface Review and Letters (SRL), 2020, vol. 27, issue 11, 1-5

Abstract: The influences of Ar+ energy and low-energy sputtering on the structure of Cu–W thin film prepared by double-ion-beam sputtering are studied. Results show that the Cu–W thin film sputtered by ion beam onto a Cu substrate is in the form of an amorphous tungsten framework mechanically mixed with Cu grains when the Cu-target Ar+ energy is within 1–2keV and the W-target Ar+ energy is 3keV. The Cu grain size increases slightly, increasing the Cu-target Ar+ energy. When the Ar+ energy increases to the critical value (≈1.5keV), a small amount of Cu is transformed into a single crystal, forming a solid solution with the melting of W. Due to crystal defects and lattice distortion, there is a small shift in the Cu diffraction peak.

Keywords: Cu–W alloy; thin film; ion beam sputtering; amorphous state (search for similar items in EconPapers)
Date: 2020
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DOI: 10.1142/S0218625X2050002X

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