ELECTROCHEMICAL MIGRATION FAILURE OF PURE TIN UNDER BROMIDE-POLLUTED THIN ELECTROLYTE LAYER

Qiao Zeng, Huikan Chen, Bokai Liao and Xingpeng Guo
Additional contact information
Qiao Zeng: School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China
Huikan Chen: School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China
Bokai Liao: School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China†Joint Institute of Guangzhou University and Institute of Corrosion Science and Technology, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China
Xingpeng Guo: School of Chemistry and Chemical Engineering, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China†Joint Institute of Guangzhou University and Institute of Corrosion Science and Technology, Guangzhou University, Guangzhou, Guangdong 510006, P. R. China‡School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, Hubei 430074, P. R. China

Surface Review and Letters (SRL), 2022, vol. 29, issue 07, 1-8

Abstract: The electrochemical migration (ECM) time to failure (TTF) tests for pure tin in the bromide-containing environment were carried out using the thin electrolyte layer (TEL) method. In-situ electrochemical measurement was made to monitor the ECM behavior while the changes of surface morphology and localized pH during the ECM process were real-time observed using the 3D optical digital microscope. Microstructure and composition of products obtained after the ECM tests were characterized using the scanning electron microscope, energy-dispersive spectrometer and X-ray diffractometer. Results indicated that the growth rate of dendrite increased with bromide ion concentration at low bromide concentration levels, and it decreased at medium concentration levels. Tree-like tin dendrites covered with white precipitates are formed after the ECM tests. As for the high bromide ion concentration condition, no dendrite can be found and a thick layer of precipitate is formed between the twin electrodes. This precipitate layer has a higher thickness than the electrolyte layer, which can act as a barrier layer retarding ionic migration and thus inhibiting the ECM failure. Relevant mechanism has been proposed to clarify the effect of bromide ions on the ECM of pure tin under the thin electrolyte layer.

Keywords: Tin; electrochemical migration; dendrite (search for similar items in EconPapers)
Date: 2022
References: Add references at CitEc
Citations:

Downloads: (external link)
http://www.worldscientific.com/doi/abs/10.1142/S0218625X22500895
Access to full text is restricted to subscribers

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:wsi:srlxxx:v:29:y:2022:i:07:n:s0218625x22500895

Ordering information: This journal article can be ordered from

DOI: 10.1142/S0218625X22500895

Access Statistics for this article

Surface Review and Letters (SRL) is currently edited by S Y Tong

More articles in Surface Review and Letters (SRL) from World Scientific Publishing Co. Pte. Ltd.
Bibliographic data for series maintained by Tai Tone Lim ().